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The Research and Prospect on Independent and Controllable Key Technologies of Microsystems
TANG Lei, KUANG Nailiang, GUO Yanrong, WANG Yanling, LI Kui, LI Baoxia, PAN Penghui,
2023, 40(1):1-10. DOI:10.19304/J.ISSN1000-7180.2022.0832
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Research progress of silicon-based 3D integrated RF passive devices and circuits
ZHU Zhangming, YIN Xiangkun, LIU Xiaoxian, YANG Yintang,
2023, 40(1):11-17. DOI:10.19304/J.ISSN1000-7180.2022.0687
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A review on 3D integration of inertial navigation microsystem
WANG Kai, KONG Yanmei, JIANG Peng, DU Xiangbin, YE Yuxin, JU Lina, CAO Zhiyong, LIU Ruiwen, JIAO Binbin,
2023, 40(1):18-30. DOI:10.19304/J.ISSN1000-7180.2022.0594
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Recent progresses of miniaturized microwave devices based on spoof surface plasmon polaritons
HAN Yajuan, LIU Yingyu, ZHAO Fuli, FU Xinmin, QIU Tianshuo, DING Chang, WANG Jiafu, QU Shaobo,
2023, 40(1):31-40. DOI:10.19304/J.ISSN1000-7180.2022.0670
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Review of MEMS LiDAR
QIAO Dayong, YUAN Weizheng, REN Yong,
2023, 40(1):41-49. DOI:10.19304/J.ISSN1000-7180.2022.0803
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Research progress of microsystem packaging based on silicon carbide devices
TIAN Wenchao, QIAN Yingying, ZHAO Jingrong, LI Zhao, LI Bin,
2023, 40(1):50-63. DOI:10.19304/J.ISSN1000-7180.2022.0717
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Review of thermal interface materials for microelectronic packaging
YANG Yujun, LI Kui, SHI Yulin, JIAO Binbin, ZHANG Zhixiang, KUANG Nailiang,
2023, 40(1):64-74. DOI:10.19304/J.ISSN1000-7180.2022.0684
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Research status and challenges of simulation technology in electronic packaging
ZHANG Shuye, HE Peng, SHAO Jianhang, LIANG Kaiming, MENG Junhao, LI Shuai, XING Jingyuan, CHENG Jingyu, JIA Xinrui,
2023, 40(1):75-86. DOI:10.19304/J.ISSN1000-7180.2022.0563
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Research progress of microchannel cooling technology for high-density microsystems
DU Peng, ZHOU Qingzhong, ZHENG Hanwen, ZHANG Yuhao, LI Jianzhu, LI Yujie,
2023, 40(1):87-96. DOI:10.19304/J.ISSN1000-7180.2022.0810
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Thermal stress analysis of all-copper interconnection in 3D IC
WANG Zhimin, HUANG Binghuan, YE Guigen, LI Kui, GONG Liang,
2023, 40(1):97-104. DOI:10.19304/J.ISSN1000-7180.2022.0639
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Embedded microfluidic cooling technology for large-area processing chips
YANG Yuchi, LYU Peijue, DU Jianyu, LI Motong, YANG Yudong, PAN Penghui, ZHENG Deyin, ZHANG Chi, WU Daowei, WANG Wei,
2023, 40(1):105-123. DOI:10.19304/J.ISSN1000-7180.2022.0765
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Mode I fracture test of SAC305 solder reinforced by nickel coated multi-walled carbon nanotubes
ZHANG Mou, QIN Fei, DAI Yanwei,
2023, 40(1):124-129. DOI:10.19304/J.ISSN1000-7180.2022.0675
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Prediction of TSV wafer warpage based on hierarchical multiscale method
SUN Guoli, QIN Fei, DAI Yanwei, LI Baoxia,
2023, 40(1):130-137. DOI:10.19304/J.ISSN1000-7180.2022.0667
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Microsystem collaborative design platform based on standardized model library and the construction of its operation service system
LI Wei, YIN Rui, WANG Zhiqiang, LIU Jie, YE Yunong,
2023, 40(1):138-146. DOI:10.19304/J.ISSN1000-7180.2022.0723
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Research on temperature drift compensation method of mems gyroscope based on neural network
GUO Gangqiang, CHAI Bo, WANG Yunshuang, ZHAO Jiantao,
2023, 40(1):147-155. DOI:10.19304/J.ISSN1000-7180.2022.0579
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Analysis and design of a SiP computer module for aerospace microsystem
HUA Hong, LIU Hongjin, LI Bin, WU Xianxiang, SUN Yin’ang,
2023, 40(1):156-164. DOI:10.19304/J.ISSN1000-7180.2022.0512
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