Review of thermal interface materials for microelectronic packaging

With the development of semiconductor devices toward miniaturization, high integration and high power density, the calorific value increases sharply. Thermal failure becomes the primary problem hindering the performance and life of microelectronic devices. High-performance thermal management materials can effectively help microelectronic components to dissipate heat. The thermal interface material (TIM) on the heat dissipation path of packaging structure is a crucial part in the thermal management. By filling the gap between the heat source and the cooling unit, TIM can reduce the contact thermal resistance and improve heat transfer efficiency. For microelectronic packaging, high-performance thermal interface materials not only need high thermal conductivity to reduce the thermal resistance of packaging, but also need a certain compressibility to make up for the assembly deviation of packaging. However, it is often difficult to take into account the above two characteristics. This paper focuses on the thermal interface material in microelectronics packaging, systematically summarizes the common types of thermal interface materials, existing problems in application, research hotspots and development status at home and abroad.