A review on 3D integration of inertial navigation microsystem

With Moore’s Law slowing down, microsystem packaging and integration technology has become one of the most promising technologies to “surpass Moore”. Inertial microsystem technology is based on micro-electro-mechanical system (MEMS), which integrates a variety of sensors on silicon substrate through heterogeneous integration technology, and develops microelectronic systems with various functions at chip level. Inertial microsystem technology has higher integration and smaller size. It can achieve chip-level navigation, positioning and other functions through built-in algorithms. The system navigates autonomously through the data collected by its own sensors to avoid being affected by the external environment. Therefore, it has a strong anti-interference ability, showing a trend of miniaturization and intelligence. In this paper, the components of inertial microsystems and the common classification of MEMS inertial sensors are discussed. By sorting out the current situation of domestic and foreign research, the characteristics and research progress of inertial microsystem integration , which are mainly focusing on the third generation integration technology are analyzed. Finally, the future research direction and development trend of inertial microsystems are discussed.