Research status and challenges of simulation technology in electronic packaging

With the continuous development of microelectronic chips, the demand for performance is also increasing, and the improvement of the performance demand also makes the requirements for the size and integration of transistors in the chips rising. In the post Moore era, the cost of chip manufacturing has gradually increased and the process of chip manufacturing become more complex due to the miniaturization of chips. Facing this situation, electronic packaging technology also plays a more important role in realizing diversified, integrated and large-scale chip packaging functions. In the research of electronic packaging technology, how to better predict the performance and reliability of electronic packaging devices has received great attention from researchers, and the continuous development of simulation technology enables researchers to see the hope of solving this problem. Simulation technology of electronic packaging has become one of the important development directions of microelectronic chip technology. This paper introduces the research status of simulation technology in the field of electronic packaging from the aspects of heat, mechanics and multiple physical fields, and also sorts out and analyzes the challenges faced by the development of simulation technology in this field.