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A research model for advanced packaging of microsystem from the perspective of digital empowerment
MING Xuefei, LI Ke, WANG Gang, TIAN Shuang, WANG Bo, ZHANG Mingxin, SU Lei,
2023, 40(11):1-8. DOI:10.19304/J.ISSN1000-7180.2023.0773
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Innovation and application of packaging technology in 5G era
ZHANG Shuye, SHAO Jianhang, HE Peng,
2023, 40(11):9-21. DOI:10.19304/J.ISSN1000-7180.2022.0767
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Research progress in hybrid bonding technology for advanced packaging applications
MA Shenglin, ZHANG Tongquan,
2023, 40(11):22-42. DOI:10.19304/J.ISSN1000-7180.2023.0677
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A review of data-driven methods on predicting solder joint fatigue lifetime in microelectronics packaging
DAI Yanwei, QIN Fei, YU Pengju, LI Kui,
2023, 40(11):43-52. DOI:10.19304/J.ISSN1000-7180.2023.0633
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A review of EDA tool development for Chiplet heterogeneous integrated microsystems
GUO Jiwang, YIN Wenting, TAN Lingyan, WANG Zongyuan,
2023, 40(11):53-60. DOI:10.19304/J.ISSN1000-7180.2023.0703
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Challenges and opportunities in the development of reliability technology for heterogeneous integrated microsystems
WANG Zhiqiang, YANG Ning, ZHANG Shaochun, SHAN Yuanhao, CUI Jingyu, HONG Li, DAI Yang,
2023, 40(11):61-71. DOI:10.19304/J.ISSN1000-7180.2023.0802
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Design of 400G FR4 silicon photonics optical transceiver module
SONG Zeguo, YIN Xiaojie, LIU Zhi, HAO Qinfen,
2023, 40(11):72-79. DOI:10.19304/J.ISSN1000-7180.2023.0700
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Wireless self-powered micro-nano integrated chip and integrated system for implantable medical devices
YE Le, GAO Meng, ZHANG Yacong, GAO Chengchen, LIU Yu, LIU Xin, ZHAO Bo, MENG Fanrui, GUI Lin, LIN Junshu, SU Bin, MA Shenglin, MA Bozhi, ZHU Bin, LIANG Chen, HUANG Ru,
2023, 40(11):80-87. DOI:10.19304/J.ISSN1000-7180.2023.0716
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Integrated design of a non-reflective filtering power divider with wide passband
YUAN Xue, HE Pengchao, SU Tao, CHEN Jianzhong, XU Kaida,
2023, 40(11):88-93. DOI:10.19304/J.ISSN1000-7180.2023.0750
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Simulations of self-heating effects and the heat generation mechanisms in SOI-MOS devices
TANG Zhenglai, CAO Bingyang,
2023, 40(11):94-103. DOI:10.19304/J.ISSN1000-7180.2023.0630
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Transient electrothermal coupling optimization method of through-silicon via based on neural network
LIU Zheng, YANG Yintang, SHAN Guangbao,
2023, 40(11):104-111. DOI:10.19304/J.ISSN1000-7180.2023.0754
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A modified calculation method of equivalent mechanical parameters for microbump layer in microsystem
LI Kui, XING Ruisi, KUANG Nailiang, YANG Yujun, WANG Chao, ZHANG Yueping, GAO Wu,
2023, 40(11):112-120. DOI:10.19304/J.ISSN1000-7180.2023.0445
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Research on finite element simulation method of microsystem packaging structure under thermal cycling loading
SHAO Fengshan, HE Zhengwei, LIU Hao, HUA Tengfei, QIU Yuanying, LI Jing,
2023, 40(11):121-127. DOI:10.19304/J.ISSN1000-7180.2023.0644
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Factors influencing BGA solder joint lifetime prediction based on the Darveaux model
HE Zhengwei, SHAO Fengshan, HUA Tengfei, LIU Hao, QIU Yuanying, LI Jing,
2023, 40(11):128-135. DOI:10.19304/J.ISSN1000-7180.2023.0636
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Size effect of solder ball on interfacial reaction of aerospace solder joints and soldering process optimization
HUANG Mingliang, YIN Siqi, ZHOU Dexiang, BAO Jie, ZHAO Fanzhi,
2023, 40(11):136-142. DOI:10.19304/J.ISSN1000-7180.2023.0487
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Research on strain measurement of package structure based on moiré interferometry
HOU Chuantao, CHENG Hao, ZHANG Yueping,
2023, 40(11):143-148. DOI:10.19304/J.ISSN1000-7180.2023.0657
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Research progress on high-density system-in-package technology and reliability
YU Muying, YANG Dongsheng, FENG Jiayun, HUANG Yilong, WANG Yiping, WANG Shuai, TIAN Yanhong,
2023, 40(11):149-156. DOI:10.19304/J.ISSN1000-7180.2023.0755
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DIR interconnection architecture for interchip Chiplet system integration
CHEN Xiao, YU Shenglin, GU Lin,
2023, 40(11):157-164. DOI:10.19304/J.ISSN1000-7180.2023.0550
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