MING X F,LI K,WANG G,et al. A research model for advanced packaging of microsystem from the perspective of digital empowerment[J]. Microelectronics & Computer,2023,40(11):1-8. doi: 10.19304/J.ISSN1000-7180.2023.0773
Citation: MING X F,LI K,WANG G,et al. A research model for advanced packaging of microsystem from the perspective of digital empowerment[J]. Microelectronics & Computer,2023,40(11):1-8. doi: 10.19304/J.ISSN1000-7180.2023.0773

A research model for advanced packaging of microsystem from the perspective of digital empowerment

  • Digital empowerment is a new type of production and research and development means that changes the traditional mode by using mathematical knowledge and digital means. It is of great significance in the field of advanced packaging. In this field, the research progress and existing research results of some international advanced enterprises are mainly focused on the refinement of production management and control. Although a variety of intelligent means such as sensors, artificial intelligence, neural network algorithms, and the Internet of Things(IoT) have been used, no systematic methods have been proposed for research on data analysis in the research stage. The fundamental reason for this is that the advanced packaging research and development system is an open and complex giant system, and it cannot be developed simply based on the design-simulation-iterative experiment mode.Based on this, a full-cycle intelligent optimization self-evolving engineering methodology is proposed based on Qian Xuesen's qualitative-quantitative method. It not only establishes packaging subsystems for each link of advanced packaging technology for microsystems, collects data for research and production processes in a targeted manner, combines advanced algorithms to build mathematical models and empirical formulas, and then analyzes and synthesizes the data through expert systems to form conclusions with sufficient scientific basis. This methodology can be used for advanced packaging research and development of microsystems, and it demonstrates the application of the results in the research process of packaging design, packaging manufacturing, etc., and summarizes the work directions that need to be carried out next.
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