Research progress on high-density system-in-package technology and reliability

With the expansion of wireless communication and other technologies in the civilian field, the performance of electronic components has been greatly improved, and at the same time, along with the improvement of the integration of electronic systems, the devices are also developed in the direction of miniaturisation, lightweight, precision and multifunctionality. And the service environment of the device becomes more demanding with the expansion of its design function, so it is especially critical to explore the effect of advanced packaging structure, material design and service reliability of the device to achieve the desired function. This paper lists the commonly used packaging technologies in wireless communication systems and their related development history, describes the characteristics of high-density packaging, potential reliability problems and briefly introduces the existing solutions.