王成刚, 周晓东, 王学伟. 基于故障仿真和粗糙集的复杂电路板测试性分析[J]. 微电子学与计算机, 2010, 27(1): 131-134.
引用本文: 王成刚, 周晓东, 王学伟. 基于故障仿真和粗糙集的复杂电路板测试性分析[J]. 微电子学与计算机, 2010, 27(1): 131-134.
WANG Cheng-gang, ZHOU Xiao-dong, WANG Xue-wei. Testability Analysis for Complex Circuit Board Based on Fault Simulation and Rough Set[J]. Microelectronics & Computer, 2010, 27(1): 131-134.
Citation: WANG Cheng-gang, ZHOU Xiao-dong, WANG Xue-wei. Testability Analysis for Complex Circuit Board Based on Fault Simulation and Rough Set[J]. Microelectronics & Computer, 2010, 27(1): 131-134.

基于故障仿真和粗糙集的复杂电路板测试性分析

Testability Analysis for Complex Circuit Board Based on Fault Simulation and Rough Set

  • 摘要: 针对关联模型在复杂电路板测试性分析中对不确定问题描述与分析的缺陷, 提出了基于故障仿真和粗糙集的测试性分析方法.通过故障仿真生成条件属性集, 利用粗糙集将其约简, 最终形成分辨矩阵, 从而评价电路的测试性水平.最后通过实例分析验证了方法的有效性.

     

    Abstract: Aiming at the limitation of dependency model in description and analysis of uncertain problem for testability analysis of complex circuit board, a testability analysis method is put forward based on fault simulation and rough set.Firstly, condition attributes are generated through fault simulation.Then, discernibility matrix is provided by rough set reduction.And moreover, the fault detection rate and fault isolation rate of circuit board can be calculated based on the matrix.Finally, an example proves that our method is feasible and effective.

     

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