Abstract: In order to make the best of the discarded bad dies, a yield enhancement technique by bad-die recycling for three-dimensional memory is proposed. In the presented technique, each block is divided into several sub-blocks firstly. After that, every die must go through the process of pre-bond test to get the fault information of blocks in a die, and then counting the number of the faulty sub-blocks in a die. Finally a fault-free block is chosen as global redundancy, and the sub-blocks in the global redundancy are used to repair faulty sub-blocks. The experimental results show that the proposed methodology is effective for yield enhancement of the three-dimensional memory.