Research on Microelectronics Assembly Solder Joint of Wing Pin Three-Dimensional Reconstruction

Solder joint three-dimensional (3D) reconstruction is one of the key research of microelectronic assembly quality detection and control technology development. During the Solder joint 3D reconstruction based on SFS theroy,the reconstruction results are not ideal because of existing specular reflection and diffuse reflection on solder joint surface.In this study,our focus on wing pin solder joint.At first,the reflection items on solder joint surface are analysised. Then, according to the characteristics of joint surface and solder joint image, a improved 3d reconstruction algorithm is proposed for microelectronics assembly wing pin solder joint.At last,the experimental results have shown that the 3D shape based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.