Research on TSV Fault with Non-contact Testing Method Based on Capacitive Coupling

Through-silicon vias seriously degrade the performance and reliability of integrated circuits and are therefore of great importance for fault detection of TSVs. Firstly, the fault model of TSV is discussed, and the effect of open fault of TSV on signal transmission delay is analyzed by using Elmore delay model. A non-contact test circuit of TSV based on capacitive coupling is proposed to detect open fault of TSV by measuring the signal delay changes, and finally time statistical analysis framework is used to predict the size of the fault resistance.