TSV Array-Based 3D ICs Design Exploration and Optimization

This paper analysis TSV array's positive effect on circuit's reliability and negative effect on timing and wire length by complete the 3D circuit (HEVC motion estimation circuit) back-end design with it. Results of the research indicated that one TSV array could have one redundant TSV in a 3*3 TSV array, and the reliability improved 11.98%, power consumption and wire length increased 19.6% and 19.2%.