基于功能细分的硅通孔容错方法
A TSV Fault-Tolerance Method Based on Functional Segmentation
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摘要: 硅通孔(Through Silicon Via, TSV)技术是现今主流的三维芯片上下层互联技术之一.将从三维片上网络(Network on Chip, NoC)垂直通道的功能细分入手: 按照TSV重要性的不同划分成组, 对不同的TSV组配置不同的冗余配置比.在现有的"包-连接电路"(PCC)平台上完成的实验显示, 该冗余容错方案保证了在TSV总数达到十万量级时, 成品率依然高达99.999 99%的同时, 面积开销与非功能细分方案相比优化了35%以上.Abstract: Through Silicon Via (TSV) technology is the mainstream of interconnection technology on 3-D stacked chips, this article implements a fault-tolerance scheme based on functional segmentation for vertical channel on 3D-NoC chips: according to the difference of importance of TSVs, we divide these TSVs into groups and configure different redundant proportion. The relevant experiments on PCC platform have shown that the fault-tolerant scheme keeps the target yield of 99.9999% when the number of TSVs reaches hundred thousand of magnitude and reduces the area overhead compared with other schemes based on non-functional segmentation by 35%.