Abstract: With the development of post-moore era, heterogeneous integration technology is becoming a practical way for microsystems engineering application, which brings advantages such as high-density integration, multi-specialty fusion, high-performance, miniaturization, and intelligence, but at the same time, it also brings a lot of potential reliability problems, which directly affects the popularization and implementation of engineering. In view of the above problems, potential failure modes based on multi-scale and multi-physical characteristics are analyzed. This review is conducted in terms of design and manufacturing capabilities, failure modes and mechanisms, reliability characterization and modeling, simulation and prediction platforms, and experimental evaluations. Some suggestions and technological challenges are put forward in the development of microsystems reliability.