Abstract: With the development of miniaturization and integration of electronic products, 2.5D packaging and 3D packaging based on Through-Silicon Vias(TSV) has been widely used in microsystem integration. The microsystem structures with a large number of micron-scale bumps and millimeter-scale packaging exhibit multi-scale characteristics, increasing the difficulty of simulation analysis and reducing the computational efficiency. In order to improve the computational efficiency and accuracy, the homogenization method for equivalent mechanical properties is essential. Analytical model and finite element model were established to calculate the equivalent mechanical properties of microbump layers in this paper. Based on contrastive analysis of prediction result, a homogenization method for equivalent mechanical properties was proposed in this paper, which combined the advantage of these two method, efficiently and accurately provided equivalent mechanical parameters of the microbump layer, and provided a technical support for the simulation analysis and evaluation of the microsystem packaging structure.