Abstract: The advent of the 5G era pushed the working frequency band of communication systems into the millimeter wave band, which brings challenges to the packaging of millimeter wave devices. The requirement for 5G systems to integrate RF, analog, digital functions and passive components and other system components in a single package module reflects the characteristics of heterogeneous integration. Among all heterogeneous integrated solutions, 2.5D/3D system-in-package (SiP) is considered as a breakthrough to solve 5G system packaging because of its high integration. Taking SiP as the entry point, the review focuses on the 2.5D/3D SiP technology and the Chiplet technology, which has attracted much attention. Based on the system-in-package solution for 5G mm wave devices, the substrate materials suitable for mm wave device packaging and the advanced packaging technologies required for SiP were discussed. In addition, the review also introduced two solutions: on-chip antenna and packaged antenna for the packaging of 5G antenna modules.