Abstract: With the increasing complexity of IC and the development of the semiconductor manufacturing process, through silicon via(TSV) has become a main interconnect technology for 3D-IC. 3D physical model of single TSV is built to analyze the effect of different physical parameter and changing size on the performance of signal transmission by return loss.The parameter extraction model of TSV is adopted to obtain the parameter of RLC.Furthermore, both the equivalent circuit model and the fault circuit model are established. The value of the crack is determined by the changing terminal voltage of the fault circuit in the frequency range of 10 GHz.At the same time, the curve on judging the value of crack is estimated with the least square method.