Abstract:
In order to meet the needs of high-bandwidth and high-density data interconnection, this paper proposes a compact Mach-Zehnder modulator structure based on IMEC's Silicon Photonic SOI process. The paper analyzes the problems in the design of high speed traveling wave electrodes in detail, including RF loss and the matching of impedance and velocity. The electro-optical modulation 3 dB bandwidth is achieved 17 GHz, and can working at 25 Gbps data rate. At the same time, in order to be applied to multi-channel high-density electro-optic integrated interconnection, the electrode structure is optimized so that the area of the MZ modulator is saved by 25%.