Abstract: Through Silicon Via (TSV) technology is the mainstream of interconnection technology on 3-D stacked chips, this article implements a fault-tolerance scheme based on functional segmentation for vertical channel on 3D-NoC chips: according to the difference of importance of TSVs, we divide these TSVs into groups and configure different redundant proportion. The relevant experiments on PCC platform have shown that the fault-tolerant scheme keeps the target yield of 99.9999% when the number of TSVs reaches hundred thousand of magnitude and reduces the area overhead compared with other schemes based on non-functional segmentation by 35%.