MIAO Min, JIN Yu-feng. A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging[J]. Microelectronics & Computer, 2021, 38(1): 1-6.
Citation: MIAO Min, JIN Yu-feng. A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging[J]. Microelectronics & Computer, 2021, 38(1): 1-6.

A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging

  • "More than Moore" has become the preferred strategy for integrated circuit and electronic, information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage, whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred, triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently, based on the personal scientific research practice, the characteristics, connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage, from the perspective of architecture evolution, chip-package co-design strategy, multi-physics co-analysis and co-optimization, and major technical innovations in integrated assembling and manufacturing; in addition, the future applications are prospected and the path of evolution is suggested.
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