Abstract:
With the continuous improvement of the integration and complexity of integrated circuits, the design and manufacturing costs of SOC rise sharply, which makes Moore's law difficult to follow. Therefore, the concept of Chiplet has attracted the attention of the industry and users. Firstly, this paper introduces the development history and technical characteristics of Chiplet, and lists the research directions, technical problems and solutions of typical international manufacturers, such as Intel, AMD, TSMC and IMEC, in the field of Chiplet. Among them, this paper focuses on the development route and research mode of TSMC as the representative of chip OEM, as well as the progress of IMEC in related technology as the representative of interconnect process development. Secondly, the problems faced by different manufacturers are summarized into four categories: EDA tools, interconnection technology, testing and standards, and discussed respectively. Then, the possible reliability and security problems of Chiplet in the future are further explored. Finally, through the analysis and summary of Chiplet's development history and typical technical cases, relevant suggestions are given for the future research of Chiplet.