李应选. Chiplet的现状和需要解决的问题[J]. 微电子学与计算机, 2022, 39(5): 1-9. DOI: 10.19304/J.ISSN1000-7180.2022.0036
引用本文: 李应选. Chiplet的现状和需要解决的问题[J]. 微电子学与计算机, 2022, 39(5): 1-9. DOI: 10.19304/J.ISSN1000-7180.2022.0036
LI Yingxuan. The state-of-the-art of Chiplet and problems need be solved[J]. Microelectronics & Computer, 2022, 39(5): 1-9. DOI: 10.19304/J.ISSN1000-7180.2022.0036
Citation: LI Yingxuan. The state-of-the-art of Chiplet and problems need be solved[J]. Microelectronics & Computer, 2022, 39(5): 1-9. DOI: 10.19304/J.ISSN1000-7180.2022.0036

Chiplet的现状和需要解决的问题

The state-of-the-art of Chiplet and problems need be solved

  • 摘要: 随着集成电路的集成度和复杂度不断提高,SoC的设计和制造费用急剧攀升,导致摩尔定律难以维持,Chiplet概念受到了业界和用户的重视.本文首先介绍了Chiplet的发展历史与技术特点,并结合当前行业发展现状,列举了典型国际厂商,如Intel、AMD、TSMC、IMEC,在Chiplet领域的研究方向、技术问题以及解决方法.其中,着重分析了TSMC作为芯片代工厂商代表,其发展路线及研究方式,以及IMEC作为互连工艺开发代表在相关技术上的进步.其次,将不同厂商所面临的问题总结为EDA工具、互连技术、测试、标准四大类,并分别进行了讨论.随后,对Chiplet将来可能存在的可靠性、安全性问题进行了进一步探索.最后,通过Chiplet的发展历史、典型案例的分析总结,对Chiplet将来的研究给出了相关的建议.

     

    Abstract: With the continuous improvement of the integration and complexity of integrated circuits, the design and manufacturing costs of SOC rise sharply, which makes Moore's law difficult to follow. Therefore, the concept of Chiplet has attracted the attention of the industry and users. Firstly, this paper introduces the development history and technical characteristics of Chiplet, and lists the research directions, technical problems and solutions of typical international manufacturers, such as Intel, AMD, TSMC and IMEC, in the field of Chiplet. Among them, this paper focuses on the development route and research mode of TSMC as the representative of chip OEM, as well as the progress of IMEC in related technology as the representative of interconnect process development. Secondly, the problems faced by different manufacturers are summarized into four categories: EDA tools, interconnection technology, testing and standards, and discussed respectively. Then, the possible reliability and security problems of Chiplet in the future are further explored. Finally, through the analysis and summary of Chiplet's development history and typical technical cases, relevant suggestions are given for the future research of Chiplet.

     

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