Abstract: In recent years, the pace of Moore's Law has slowed down, and the cost of chip manufacturing under advanced technology has become higherand higher. How to maintain the original pace of developmentunder reasonable cost control has become an important issue facing the semiconductor industry.Chiplet technology is valuedby the industry as a solution that can continue Moore's Law, but there are still many problems with its widespread use. The characteristics and challenges of Chiplet technology are analyzed from the perspective of integration, interconnection, and design process. First, the performance and cost of the Chiplet integration on different types of substrates are compared, and the possible Chiplet integration solutions are looked forward to. Secondly, based on the principles of parallel and serial interconnection, a possible method for high-speed and low-power interconnection between Chiplets is proposedby comparing the parameters and performance of the current main Chiplet interconnection schemes. Finally, the necessity and possibility of improving the design flow are analyzed. The above research shows that Chiplet technology needs to choose a suitable integration process based on cost considerations, and explore high-speed and low-power interconnect methods based on the integration process. It is also urgent to establish interconnection standards to promote the popularization and application of Chiplet technology, and new tools and design methods need to be introduced intothe design process of Chiplet technology.